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Sunday, August 29, 2021 | History

3 edition of Preventing thermal cycling and vibration failures in electronic equipment found in the catalog.

Preventing thermal cycling and vibration failures in electronic equipment

Dave S. Steinberg

Preventing thermal cycling and vibration failures in electronic equipment

  • 247 Want to read
  • 35 Currently reading

Published by J. Wiley in New York .
Written in English

    Subjects:
  • Electronic apparatus and appliances -- Thermal properties,
  • Electronic apparatus and appliances -- Vibration,
  • Electronic apparatus and appliances -- Protection,
  • System failures (Engineering)

  • Edition Notes

    Includes bibliographical references (p. 270-272) and index

    StatementDave S. Steinberg
    Classifications
    LC ClassificationsTK7870.25 .S7324 2001
    The Physical Object
    Paginationxxi, 282 p. :
    Number of Pages282
    ID Numbers
    Open LibraryOL18123364M
    ISBN 100471357294
    LC Control Number2001024704

      “Reliability and Failure of Electronic Materials and Devices” by Milton Ohring • ISBN “ Preventing Thermal Cycling and Vibration . Electronic components have a wide range of failure can be classified in various ways, such as by time or cause. Failures can be caused by excess . Vibration Analysis for Electronic Equipment (3rd Edition) A practical guide to quick methods for designing electronic equipment that must withstand severe . • Focused on the Interconnect failure in the printed circuit board and component level packages due to a combination of thermal mismatch, stress accumulation Title: Ph.D. Candidate & SRC Research .


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Preventing thermal cycling and vibration failures in electronic equipment by Dave S. Steinberg Download PDF EPUB FB2

This item: Preventing Thermal Cycling and Vibration Failures in Electronic Equipment by Dave S. Steinberg Hardcover Only 2 left in stock (more on the way). Cited by: Preventing Thermal Cycling and Vibration Failures in Electronic Equipment - Kindle edition by Steinberg, Dave S.

Download it once and read it on your Kindle device 5(4). This book deals with the packaging of electronic equipment to prevent damage from vibration and exposure to large variations in temperature. Dave : Wiley.

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Key words: temperature cycling, thermal cycling, fatigue, reliability, solder joint reliability. INTRODUCTION The excessive difference in coefficients of thermal. of all failures observed in electronic equipment were due to vibration problems Why Care About ThermalMechanical Reliability.

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Thermal mismatch of materials can cause, among other things, solder joint cracking, hermetic seal failures and damage to leads and markings. Cycling rates and.

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